System-in-package or SIP is a number of integrated circuits enclosed in a single module. Dies containing integrated circuits, may be stacked vertically on a substrate. They are internally connected by fine wires that are bonded to the package.
SIP Applications
SIP products are particularly suitable for applications in harsh environments such as:
- Aerospace
Satellite, Spaceship, Launch vehicle, Deep Space Probes - Communications
Radar, TCTM systems - Aviation
Aircraft, Helicopter, Flight data recorder - Industrial Control
Data Storage, Automation Equipment